Ever wondered how a chip is made? These amazing high-res images from Intel show the process step-by-step.
Page 2 - Slicing and dicing
Ingot Slicing
scale: wafer level (~300mm / 12 inch)
The Ingot is cut into individual silicon discs called wafers.
Wafer
scale: wafer level (~300mm/ 12 inch)
The wafers are polished until they have flawless, mirror-smooth surfaces. Intel buys those manufacturing ready wafers from third party companies. Intel’s highly advanced 45nm High-K/Metal Gate process uses wafers with a diameter of 300 millimeter (~12 inches). When Intel first began making chips, the company printed circuits on 2-inch (50mm) wafers. Now the company uses 300mm wafers, resulting in decreased costs per chip.

Applying Photo Resist
scale: wafer level (~300mm / 12 inch)
The liquid (blue here) that’s poured onto the wafer while it spins is a photo resist finish similar as the one known from film photography. The wafer spins during this step to allow very thin and even application of this photo resist layer.
