Ever wondered how a chip is made? These amazing high-res images from Intel show the process step-by-step.
Page 5 - Bombarding with ions
Ion Implantation
scale: transistor level (~50-200nm)
Through a process called ion implantation (one form of a process called doping), the exposed areas of the silicon wafer are bombarded with various chemical impurities called Ions. Ions are implanted in the silicon wafer to alter the way silicon in these areas conducts electricity. Ions are shot onto the surface of the wafer at very high speed. An electrical field accelerates the ions to a speed of over 300,000 km/h (~185,000 mph)
Removing Photo Resist
scale: transistor level (~50-200nm)
After the ion implantation the photo resist will be removed and the material that should have been doped (green) has alien atoms implanted now (notice slight variations in color)
Ready Transistor
scale: transistor level (~50-200nm)
This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper which will make up the connections to other transistors.
