Ever wondered how a chip is made? These amazing high-res images from Intel show the process step-by-step.
Page 6 - Electroplating the chip
Electroplating
scale: transistor level (~50-200nm)
The wafers are put into a copper sulphate solution as this stage. The copper ions are deposited onto the transistor thru a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.
After Electroplating
scale: transistor level (~50-200nm)
On the wafer surface the copper ions settle as a thin layer of copper.
Polishing
scale: transistor level (~50-200nm)
The excess material is polished off.
v