Page 8 - Chucking faulty chips
Ever wondered how a chip is made? These amazing high-res images from Intel show the process step-by-step.
Discarding faulty dies
scale: wafer level (~300mm / 12 inch)
The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging).
scale: die level (~10mm / ~0.5 inch)
This is an individual die which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 Processor .
scale: package level (~20mm / ~1 inch)
The substrate, the die and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be put on to. This will keep the processor cool during operation.